Discover 8 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Material Length Width Diameter Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
260-4T5E
Wakefield-Vette
547
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-5 EPOXY INSUL BLK
260 Board Level Beryllium Copper 0.370" (9.40mm) 0.380" (9.65mm) 0.290" (7.37mm) ID TO-5 - - - 14.00°C/W Black Ebonol
V5358
ASSMANN WSW Components
1,768
3 days
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MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Board Level Aluminum 0.709" (18.00mm) 0.472" (12.00mm) - - 0.177" (4.50mm) - - - -
2262R
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Top Mount Aluminum - - 0.318" (8.07mm) ID, 0.602" (15.29mm) OD TO-5 0.250" (6.35mm) 1.6W @ 80°C 30.00°C/W @ 200 LFM - Red Anodized
2263R
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Top Mount Aluminum - - 0.318" (8.07mm) ID, 0.750" (19.05mm) OD TO-5 0.437" (11.10mm) 1.6W @ 60°C 10.00°C/W @ 600 LFM - Red Anodized
260-4TH5E
Wakefield-Vette
Inquiry
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MOQ: 1  MPQ: 1
CUP CLIP TRANSISTOR C3488 REV H
260 Board Level Beryllium Copper 0.400" (10.16mm) 0.370" (9.40mm) 0.290" (7.37mm) ID TO-5 - - - 14.00°C/W Black Ebonol
260-6SH5E
Wakefield-Vette
Inquiry
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MOQ: 1  MPQ: 1
HEAT SINK FOR TO-5 PKG
260 Board Level Beryllium Copper 0.557" (14.15mm) 0.370" (9.40mm) 0.290" (7.37mm) ID TO-5 - - - 14.00°C/W Black Ebonol
TXP1808B
CTS Thermal Management Products
Inquiry
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MOQ: 1  MPQ: 1
THERMAL LINK PRESS ON BLACK TO-1
- Top Mount Brass 0.340" (8.64mm) 0.220" (5.59mm) 0.220" (5.59mm) OD TO-18 - - - - Black Cadmium
TXP1808ND
CTS Thermal Management Products
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK PRESS ON NICKEL TO-18
- Top Mount Brass 0.340" (8.64mm) 0.220" (5.59mm) 0.220" (5.59mm) OD TO-18 - - - - Dull Nickel