- Shape：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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ASSMANN WSW Components |
821
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM W/PIN TO-220
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Board Level, Vertical | Rectangular, Fins | 1.476" (37.50mm) | 1.260" (32.00mm) | TO-220 | 0.787" (19.99mm) | - | - | ||
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ASSMANN WSW Components |
154
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD TO-220
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Board Level | Rectangular, Fins | 1.181" (30.00mm) | 1.260" (32.00mm) | TO-220 | 0.787" (19.99mm) | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rhombus | 1.550" (39.37mm) | 1.040" (26.42mm) | TO-66 | 1.250" (31.75mm) | 7.0W @ 50°C | 4.00°C/W @ 200 LFM | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rhombus | 1.550" (39.37mm) | 1.040" (26.42mm) | TO-66 | 1.000" (25.40mm) | 4.0W @ 40°C | 4.00°C/W @ 300 LFM |
