- Manufacturer:
-
- Type:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
- Selected conditions:
Discover 3 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | ||
ASSMANN WSW Components |
267
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
Top Mount | Rectangular, Fins | 1.811" (46.00mm) | TO-220 | 1.299" (33.00mm) | 3.20°C/W | Black Anodized | ||||
Delta Electronics |
12
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ASSY INTEL NEHALEM 1366
|
Board Level | Square, Fins | 3.543" (90.00mm) | LGA | 1.004" (25.50mm) | 0.26°C/W | - | ||||
Delta Electronics |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ASSY INTEL LGA1366
|
Board Level | Square | 3.543" (90.00mm) | LGA | 1.004" (25.50mm) | 0.27°C/W | - |