- Manufacturer:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Selected conditions:
Discover 9 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Wakefield-Vette |
7,793
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 VERT/HORZ BLK
|
290 | Board Level | TO-218, TO-202, TO-220 | 2.0W @ 44°C | 7.00°C/W @ 400 LFM | 22.00°C/W | ||||
Wakefield-Vette |
7,520
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 DUAL MNT BLK
|
290 | Board Level | TO-218, TO-202, TO-220 (Dual) | 2.0W @ 44°C | 7.00°C/W @ 400 LFM | 22.00°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
13,219
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.5W H=.5" BLK
|
- | Board Level | TO-220 | 4.0W @ 80°C | 6.00°C/W @ 600 LFM | 16.70°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
10,007
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK 1.18"
|
- | Board Level | TO-220 | 4.0W @ 80°C | 6.00°C/W @ 600 LFM | 16.70°C/W | ||||
ASSMANN WSW Components |
1,684
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 29.97X25.40MM
|
- | Board Level | TO-220 | - | - | 20.00°C/W | ||||
Advanced Thermal Solutions Inc. |
2,970
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK
|
- | Board Level | TO-220 | - | 11.00°C/W @ 200 LFM | 16.70°C/W | ||||
CUI Inc. |
981
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.2W ALUMINUM
|
- | Board Level | TO-220 | 4.2W @ 75°C | 5.88°C/W @ 200 LFM | 17.74°C/W | ||||
CUI Inc. |
974
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.2W ALUMINUM
|
- | Board Level | TO-220 | 4.2W @ 75°C | 5.88°C/W @ 200 LFM | 17.74°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level, Vertical | TO-220 | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 13.40°C/W |