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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Selected conditions:
Discover 15 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
12,250
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Copper | 1.030" (26.16mm) | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Copper | 1.030" (26.16mm) | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
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- | Copper | 1.030" (26.16mm) | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D2PAK
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- | Copper | 1.030" (26.16mm) | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
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ASSMANN WSW Components |
1,010
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 12.70X26.20MM
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- | Copper | 1.031" (26.20mm) | TO-263 (D2Pak) | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,250
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Copper | 1.220" (30.99mm) | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Copper | 1.220" (30.99mm) | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D-PAK3 TIN PLATED SMD
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- | Copper | 1.220" (30.99mm) | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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ASSMANN WSW Components |
3,600
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 12.70X26.20MM
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- | Copper | 1.031" (26.20mm) | TO-263 (D2Pak) | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
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ASSMANN WSW Components |
3,836
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 12.70X26.20MM
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- | Copper | 1.031" (26.20mm) | TO-263 (D2Pak) | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
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ASSMANN WSW Components |
3,836
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 12.70X26.20MM
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- | Copper | 1.031" (26.20mm) | TO-263 (D2Pak) | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
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Apex Microtechnology |
31
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT
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Apex Precision Power | Copper | 1.220" (30.99mm) | SMD | 0.400" (10.16mm) | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable | ||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM NATURAL SMD
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218 | Copper | 1.030" (26.16mm) | SMD | 0.400" (10.16mm) | 2.3W @ 40°C | 5.00°C/W @ 600 LFM | 31.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | - | 1.220" (30.99mm) | D3Pak | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 26.2X12.7X9.9MM
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- | Copper | 1.031" (26.20mm) | TO-263 (D2Pak) | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | - | Tin |
