- Manufacturer：
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- Type：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
6,500
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220
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Top Mount | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
Top Mount | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220
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Top Mount | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
12,216
|
3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .45" D2PAK
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Top Mount | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | ||
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ASSMANN WSW Components |
626
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 19.38X25.40MM
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Top Mount | - | - | 23.00°C/W | ||
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Comair Rotron |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 19.4X25.4X11.4MM
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Board Level | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - |
