Discover 4 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Type Length Width Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Natural
HS27
Apex Microtechnology
100
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 12P PWR SIP
Board Level 3.000" (76.20mm) 2.360" (59.94mm) PSIP 0.630" (16.00mm) 5.30°C/W
HS23
Apex Microtechnology
5
3 days
-
MOQ: 1  MPQ: 1
HEATSINK WAKEFIELD 232-200AB
Board Level, Vertical 2.000" (50.80mm) 1.380" (35.05mm) TO-220 0.500" (12.70mm) 10.00°C/W
HS28
Apex Microtechnology
10
3 days
-
MOQ: 1  MPQ: 1
HEATSINK SIP
Board Level, Vertical 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) -
HS22
Apex Microtechnology
10
3 days
-
MOQ: 1  MPQ: 1
HEATSINK THERMALLOY 6025B
Board Level, Vertical 1.250" (31.75mm) 0.875" (22.22mm) TO-220 0.250" (6.35mm) 20.00°C/W