- Attachment Method:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Selected conditions:
Discover 2 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
24,857
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3 days |
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MOQ: 1 MPQ: 1
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HEATSINK 24-PIN DIP GLUE-ON BLK
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1.250" (31.75mm) | 0.530" (13.46mm) | Thermal Tape, Adhesive (Not Included) | 0.190" (4.83mm) | 1.0W @ 40°C | 15.00°C/W @ 500 LFM | 34.00°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK 24-DIP BLK ANODIZED
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1.460" (37.08mm) | 1.008" (25.60mm) | Press Fit, Slide On | 0.580" (14.73mm) | 1.0W @ 20°C | 6.00°C/W @ 400 LFM | 20.00°C/W |