- Material:
-
- Attachment Method:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
Discover 3 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 0.620" (15.75mm) | 0.915" (23.24mm) | Clip | 1.5W @ 40°C | 6.00°C/W @ 600 LFM | 16.00°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | 0.620" (15.75mm) | 0.845" (21.46mm) | Clip | 2.0W @ 50°C | 6.00°C/W @ 400 LFM | 20.60°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Copper | 0.795" (20.19mm) | 0.915" (23.24mm) | Clip and PC Pin | 1.0W @ 30°C | 6.00°C/W @ 600 LFM | 16.00°C/W | Tin |