- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
3,006
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK W/TAB BLACK
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Board Level, Vertical | 1.220" (30.99mm) | 1.000" (25.40mm) | Clip and PC Pin | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 300 LFM | 11.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 0.620" (15.75mm) | 0.915" (23.24mm) | Clip | 0.380" (9.65mm) | 1.5W @ 40°C | 6.00°C/W @ 600 LFM | 16.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 0.620" (15.75mm) | 0.845" (21.46mm) | Clip | 0.380" (9.65mm) | 2.0W @ 50°C | 6.00°C/W @ 400 LFM | 20.60°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | 1.220" (30.99mm) | 1.000" (25.40mm) | Clip | 0.500" (12.70mm) | 3.0W @ 40°C | 4.00°C/W @ 300 LFM | 11.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 CLIP-ON W/TABS
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Board Level, Vertical | 1.220" (30.99mm) | 1.000" (25.40mm) | Clip and Board Locks | 0.500" (12.70mm) | 2.0W @ 30°C | 5.00°C/W @ 200 LFM | 11.50°C/W |
