- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Selected conditions:
Discover 2 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
CUI Inc. |
934
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220/TO-
|
1.000" (25.40mm) | 4.7W @ 75°C | 4.93°C/W @ 200 LFM | 15.96°C/W | ||||
CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220/TO-
|
1.500" (38.10mm) | 5.9W @ 75°C | 4.44°C/W @ 200 LFM | 12.71°C/W |