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Discover 14 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
114
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3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 50X50X14MM
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Top Mount | Copper | Square, Fins | 1.969" (50.00mm) | 1.969" (50.00mm) | - | Push Pin | 0.551" (14.00mm) | - | 2.10°C/W @ 200 LFM | 8.90°C/W | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
117
|
3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 57.9X59X11MM
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Top Mount | Copper | Rectangular, Fins | 2.323" (59.00mm) | 2.280" (57.91mm) | - | Push Pin | 0.433" (11.00mm) | - | 1.90°C/W @ 200 LFM | 7.70°C/W | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
116
|
3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 38.5X37.6X14MM
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Top Mount | Copper | Rectangular, Fins | 1.480" (37.59mm) | 1.516" (38.50mm) | - | Push Pin | 0.551" (14.00mm) | - | 2.60°C/W @ 200 LFM | 15.90°C/W | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
125
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3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 90X90X10MM
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Top Mount | Copper | Square, Fins | 3.543" (90.00mm) | 3.543" (90.00mm) | - | Push Pin | 0.394" (10.00mm) | - | 1.30°C/W @ 200 LFM | 4.50°C/W | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
82
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3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 60X60X22MM
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Top Mount | Copper | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | - | Push Pin | 0.866" (22.00mm) | - | 0.80°C/W @ 300 LFM | 7.20°C/W | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
60
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3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 45X44X22.5MM
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Top Mount | Copper | Square, Fins | 1.732" (44.00mm) | 1.772" (45.00mm) | - | Push Pin | 0.886" (22.50mm) | - | 1.65°C/W @ 200 LFM | 8.00°C/W | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
88
|
3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 40X40.5X13.5MM
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Top Mount | Copper | Square, Fins | 1.594" (40.50mm) | 1.575" (40.00mm) | - | Push Pin | 0.531" (13.49mm) | - | 2.50°C/W @ 200 LFM | 13.30°C/W | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
75
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3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 60X60X14MM
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Top Mount | Copper | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | - | Push Pin | 0.551" (14.00mm) | - | 1.70°C/W @ 200 LFM | 7.00°C/W | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
80
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3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 70X69X14MM
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Top Mount | Copper | Square, Fins | 2.717" (69.00mm) | 2.756" (70.00mm) | - | Push Pin | 0.551" (14.00mm) | - | 1.40°C/W @ 200 LFM | 5.60°C/W | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 80X80X12MM
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Top Mount | Copper | Square, Fins | 3.150" (80.00mm) | 3.150" (80.00mm) | - | Push Pin | 0.472" (12.00mm) | - | 1.20°C/W @ 200 LFM | 5.10°C/W | AavSHIELD 3C | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BGA HEAT SINK
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Top Mount | Aluminum | Square, Fins | 0.985" (25.02mm) | 0.985" (25.02mm) | - | Thermal Tape, Adhesive (Included) | 0.390" (9.91mm) | - | 5.30°C/W @ 200 LFM | 10.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Cylindrical | - | - | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD | Thermal Tape, Adhesive (Not Included) | - | 1.5W @ 40°C | 8.00°C/W @ 400 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Square | 0.790" (20.07mm) | 0.790" (20.07mm) | - | Thermal Tape, Adhesive (Not Included) | 0.155" (3.94mm) | 1.0W @ 40°C | 20.00°C/W @ 200 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Square, Fins | 0.655" (16.64mm) | 0.655" (16.64mm) | - | Thermal Tape, Adhesive (Not Included) | 0.265" (6.73mm) | 1.0W @ 40°C | 17.50°C/W @ 300 LFM | - | Black Anodized |
