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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
118
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK AL6063 288X188X16.5MM
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- | Top Mount | Aluminum | Rectangular, Fins | 7.402" (188.00mm) | 7.402" (188.00mm) | Adhesive | - | - | 0.60°C/W @ 600 LFM | 4.00°C/W | Degreased | |||
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Wakefield-Vette |
4,378
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.65"
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628 | Top Mount | Aluminum | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,000
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3 days |
-
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MOQ: 1 MPQ: 1
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ANCHOR HEATSINK 23X23X16.5MM
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Wave 2x | Board Level | Aluminum Alloy | Square, Angled Fins | 0.906" (23.00mm) | 0.906" (23.00mm) | Clip | BGA | - | 5.08°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 43MM SQ BLK H=.65"
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628 | Top Mount | Aluminum | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Black Anodized |
