- Material:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Selected conditions:
Discover 4 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
CUI Inc. |
1,950
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | ||||
CUI Inc. |
2,094
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | ||||
CUI Inc. |
2,094
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 19.
|
Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | TO-220 | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | ||||
CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK HALF BRICK ALUM BLACK
|
Aluminum | Square, Fins | 2.402" (61.00mm) | 2.264" (57.50mm) | Bolt On | Half Brick DC/DC Converter | - | 4.60°C/W @ 200 LFM | 10.30°C/W | Black Anodized |