Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Discover 2 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Shape Length Width Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
HS02
Apex Microtechnology
381
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 8P TO-3 4.5C/W
Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) TO-3 10.0W @ 50°C 2.00°C/W @ 300 LFM 4.50°C/W
HS18
Apex Microtechnology
31
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 12P DIP
Rectangular, Fins 5.421" (139.70mm) 4.612" (117.14mm) PDIP - - 1.00°C/W