- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 5 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
956
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 5.1W ALUMINUM
|
Bolt On and Board Mounts | 5.1W @ 75°C | 4.20°C/W @ 200 LFM | 14.71°C/W | ||
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CUI Inc. |
998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.7W ALUMINUM
|
Bolt On and Board Mounts | 4.7W @ 75°C | 5.87°C/W @ 200 LFM | 15.83°C/W | ||
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|
|
CUI Inc. |
968
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 5.1W ALUMINUM
|
Bolt On and Board Mounts | 5.1W @ 75°C | 4.20°C/W @ 200 LFM | 14.71°C/W | ||
|
|
|
CUI Inc. |
894
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.7W ALUMINUM
|
Bolt On and Board Mounts | 4.7W @ 75°C | 5.87°C/W @ 200 LFM | 15.83°C/W | ||
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|
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CUI Inc. |
394
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4.6W ALUMINUM
|
PC Pin | 4.6W @ 75°C | 5.44°C/W @ 200 LFM | 16.30°C/W |
