- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 7 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
3,250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
Copper | 1.220" (30.99mm) | SMD Pad | D3Pak | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
Copper | 1.220" (30.99mm) | SMD Pad | D3Pak | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
3,255
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D-PAK3 TIN PLATED SMD
|
Copper | 1.220" (30.99mm) | SMD Pad | D3Pak | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
2,750
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
Copper | 1.031" (26.20mm) | - | TO-263 (D2Pak) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | |||
|
|
Advanced Thermal Solutions Inc. |
2,833
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
Copper | 1.031" (26.20mm) | - | TO-263 (D2Pak) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | |||
|
|
Advanced Thermal Solutions Inc. |
2,833
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
Copper | 1.031" (26.20mm) | - | TO-263 (D2Pak) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | |||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
|
- | 1.220" (30.99mm) | SMD Pad | D3Pak | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W |
