- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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Discover 8 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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CTS Thermal Management Products |
1,900
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 5.30°C/W @ 200 LFM | ||
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|
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CTS Thermal Management Products |
969
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 2.50°C/W @ 200 LFM | ||
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|
|
CTS Thermal Management Products |
371
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 5.30°C/W @ 200 LFM | ||
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|
|
CTS Thermal Management Products |
1,356
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 3.30°C/W @ 200 LFM | ||
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|
|
CTS Thermal Management Products |
438
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 2.50°C/W @ 200 LFM | ||
|
|
|
CTS Thermal Management Products |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Top Mount | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 3.30°C/W @ 200 LFM | ||
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CTS Thermal Management Products |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK VERT W/TABS BLK TO-220
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7 | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.380" (35.05mm) | Bolt On and PC Pin | TO-220 | 2.0W @ 30°C | - | ||
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CTS Thermal Management Products |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK VERT W/TABS BLK TO-220
|
7 | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 0.054" (1.38mm) | Bolt On and PC Pin | TO-220 | 2.0W @ 30°C | - |
