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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | 0.620" (15.75mm) | 0.915" (23.24mm) | Clip | 1.5W @ 40°C | 6.00°C/W @ 600 LFM | 16.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | 0.620" (15.75mm) | 0.845" (21.46mm) | Clip | 2.0W @ 50°C | 6.00°C/W @ 400 LFM | 20.60°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Copper | 0.795" (20.19mm) | 0.915" (23.24mm) | Clip and PC Pin | 1.0W @ 30°C | 6.00°C/W @ 600 LFM | 16.00°C/W | Tin |
