- Manufacturer:
-
- Length:
-
- Width:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Selected conditions:
Discover 12 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
CTS Thermal Management Products |
3,997
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE .91"SQ
|
BDN | Top Mount | Square, Pin Fins | 0.910" (23.11mm) | 0.910" (23.11mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 9.60°C/W @ 400 LFM | 26.90°C/W | ||||
CTS Thermal Management Products |
2,354
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.11"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.110" (28.19mm) | 1.110" (28.19mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 7.20°C/W @ 400 LFM | 20.90°C/W | ||||
CTS Thermal Management Products |
1,776
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.41"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.410" (35.81mm) | 1.410" (35.81mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 5.60°C/W @ 400 LFM | 16.20°C/W | ||||
CTS Thermal Management Products |
192
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.21"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.210" (30.73mm) | 1.210" (30.73mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 6.80°C/W @ 400 LFM | 19.60°C/W | ||||
CTS Thermal Management Products |
652
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.31"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.310" (33.27mm) | 1.310" (33.27mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 6.00°C/W @ 400 LFM | 16.10°C/W | ||||
CTS Thermal Management Products |
979
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.81"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 3.50°C/W @ 400 LFM | 10.80°C/W | ||||
CTS Thermal Management Products |
546
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.61"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.610" (40.89mm) | 1.610" (40.89mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 4.50°C/W @ 400 LFM | 13.50°C/W | ||||
CTS Thermal Management Products |
3,767
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU .91" SQ
|
BDN | Top Mount | Square, Pin Fins | 0.910" (23.11mm) | 0.910" (23.11mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 9.60°C/W @ 400 LFM | 26.90°C/W | ||||
CTS Thermal Management Products |
113
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.71"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.710" (43.43mm) | 1.710" (43.43mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 3.80°C/W @ 400 LFM | 11.50°C/W | ||||
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.01"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.010" (25.65mm) | 1.010" (25.65mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 8.00°C/W @ 400 LFM | 26.40°C/W | ||||
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.51"SQ
|
BDN | Top Mount | Square, Pin Fins | 1.510" (38.35mm) | 1.510" (38.35mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 4.50°C/W @ 400 LFM | 15.10°C/W | ||||
Comair Rotron |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK STAMP 10X21.2X19MM
|
- | Board Level | Rectangular | 0.750" (19.05mm) | 0.860" (21.84mm) | Bolt On | TO-220 | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | - |