- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
- Selected conditions:
Discover 3 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | |
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED 43X43X15MM
|
APR | Top Mount | Aluminum | Square, Pin Fins | 1.657" (42.10mm) | 1.657" (42.10mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 2.00°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APR | Top Mount | Aluminum | Square, Pin Fins | 1.657" (42.10mm) | 1.657" (42.10mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 2.00°C/W @ 200 LFM | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PRESSON PANEL MNT TO-92
|
- | Board Level, Vertical | Beryllium Copper | Rectangular | 0.113" (2.87mm) | 0.530" (13.46mm) | Bolt On and Clip | - | - | Unfinished |
