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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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ASSMANN WSW Components |
25,551
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM CPU
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Square, Pin Fins | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | - | 31.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
19
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK AL6063 300X41X7MM
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Rectangular, Fins | 11.800" (299.72mm) | 1.614" (41.00mm) | Adhesive | - | 17.70°C/W @ 200 LFM | 47.40°C/W | Degreased |
