- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
Discover 4 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
Advanced Thermal Solutions Inc. |
63
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 24.5MM
|
Thermal Tape, Adhesive (Included) | 0.3W @ 20°C | 6.00°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
99
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 21MM X 21MM X 24.5MM
|
Thermal Tape, Adhesive (Included) | - | 6.50°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 21X21X24.5MM W/OUT TIM
|
Thermal Tape, Adhesive (Not Included) | 0.3W @ 20°C | 6.00°C/W @ 200 LFM | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 21X21X24.5MM W/OUT TIM
|
Thermal Tape, Adhesive (Not Included) | - | 6.50°C/W @ 200 LFM |
