- Manufacturer：
-
- Material：
-
- Shape：
-
- Length：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Selected conditions:
Discover 5 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
t-Global Technology |
5,067
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 10X10X2MM
|
XL-25 | Heat Spreader | Ceramic | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | - | - | ||
|
|
|
t-Global Technology |
5,198
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 20X20X2MM
|
XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | - | - | ||
|
|
Advanced Thermal Solutions Inc. |
1,675
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Board Level | Aluminum | Rectangular, Fins | 1.181" (30.00mm) | 1.772" (45.00mm) | Bolt On | TO-220 | 11.00°C/W @ 200 LFM | 23.00°C/W | |||
|
|
|
t-Global Technology |
491
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 30X30X2MM
|
XL-25 | Heat Spreader | Ceramic | Square | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | - | - | ||
|
|
|
t-Global Technology |
266
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 40X40X2MM
|
XL-25 | Heat Spreader | Ceramic | Square | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | - | - |
