- Material：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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Discover 26 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
1,469
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.378" (35.00mm) | PC Pin | 5.5W @ 75°C | 4.39°C/W @ 200 LFM | 13.64°C/W | ||
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CUI Inc. |
1,383
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.378" (35.00mm) | PC Pin | 5.2W @ 75°C | 4.42°C/W @ 200 LFM | 14.42°C/W | ||
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CUI Inc. |
1,016
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220,25.
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HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.375" (34.93mm) | PC Pin | 5.8W @ 75°C | 3.28°C/W @ 200 LFM | 12.93°C/W | ||
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CUI Inc. |
1,123
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220, 25
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.772" (45.00mm) | PC Pin | 6.4W @ 75°C | 3.86°C/W @ 200 LFM | 11.72°C/W | ||
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CUI Inc. |
1,195
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Aluminum Alloy | 1.000" (25.40mm) | 1.378" (35.00mm) | PC Pin | 5.5W @ 75°C | 8.36°C/W @ 200 LFM | 13.64°C/W | ||
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CUI Inc. |
994
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
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- | Board Level | Aluminum | 0.748" (19.00mm) | 0.504" (12.80mm) | PC Pin | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | ||
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CUI Inc. |
995
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.3W ALUMINUM
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- | Board Level | Aluminum | 0.591" (15.00mm) | 0.504" (12.80mm) | - | 2.3W @ 75°C | 11.04°C/W @ 200 LFM | 33.28°C/W | ||
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CUI Inc. |
981
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.2W ALUMINUM
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- | Board Level | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On | 4.2W @ 75°C | 5.88°C/W @ 200 LFM | 17.74°C/W | ||
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|
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CUI Inc. |
974
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.2W ALUMINUM
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- | Board Level | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Bolt On | 4.2W @ 75°C | 5.88°C/W @ 200 LFM | 17.74°C/W | ||
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CUI Inc. |
998
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 2.9W ALUMINUM
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- | Board Level | Aluminum | 0.748" (19.00mm) | 0.504" (12.80mm) | - | 2.9W @ 75°C | 7.24°C/W @ 200 LFM | 25.92°C/W | ||
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CUI Inc. |
475
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4W ALUMINUM
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- | Board Level, Vertical | Aluminum | 1.500" (38.10mm) | 0.504" (12.80mm) | PC Pin | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W | ||
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CUI Inc. |
360
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 4W ALUMINUM
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- | Board Level | Aluminum | 1.500" (38.10mm) | 0.504" (12.80mm) | - | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4W ALUMINUM
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- | Board Level | Aluminum | 1.500" (38.10mm) | 0.504" (12.80mm) | PC Pin | 4.0W @ 75°C | 5.01°C/W @ 200 LFM | 18.63°C/W | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 38
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.500" (38.10mm) | 1.375" (34.93mm) | PC Pin | 6.5W @ 75°C | 3.66°C/W @ 200 LFM | 11.54°C/W | ||
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|
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CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 38
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.500" (38.10mm) | 1.378" (35.00mm) | PC Pin | 6.9W @ 75°C | 3.32°C/W @ 200 LFM | 10.87°C/W | ||
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|
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CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 38
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.500" (38.10mm) | 1.378" (35.00mm) | PC Pin | 7.0W @ 75°C | 2.67°C/W @ 200 LFM | 10.71°C/W | ||
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|
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
|
HSE | Board Level, Vertical | Aluminum Alloy | 2.000" (50.80mm) | 1.375" (34.93mm) | PC Pin | 7.8W @ 75°C | 5.17°C/W @ 200 LFM | 9.62°C/W | ||
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|
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CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
|
HSE | Board Level, Vertical | Aluminum Alloy | 2.000" (50.80mm) | 1.378" (35.00mm) | PC Pin | 8.2W @ 75°C | 4.76°C/W @ 200 LFM | 9.15°C/W | ||
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|
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CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 38
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.500" (38.10mm) | 1.378" (35.00mm) | PC Pin | 6.7W @ 75°C | 3.53°C/W @ 200 LFM | 11.19°C/W | ||
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|
|
CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
|
HSE | Board Level, Vertical | Aluminum Alloy | 2.000" (50.80mm) | 1.378" (35.00mm) | PC Pin | 7.8W @ 75°C | 5.17°C/W @ 200 LFM | 9.62°C/W |
