- Length：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
350
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR POWERPC CPU BLK
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609 | 2.895" (73.53mm) | 2.000" (50.80mm) | Clip, Thermal Material | Assorted (BGA, LGA, CPU, ASIC...) | 2.50°C/W @ 250 LFM | ||
|
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TE Connectivity Raychem Cable Protection |
209
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK
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- | - | - | Adhesive | - | - |
