- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Discover 7 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
17,317
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-220 .500" COMPACT
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- | Board Level | 0.520" (13.21mm) | Bolt On | TO-220 | 1.5W @ 40°C | 24.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
6,180
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 .500" COMPACT
|
- | Board Level, Vertical | 0.520" (13.21mm) | Bolt On and PC Pin | TO-220 | 1.5W @ 40°C | 24.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
5,701
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-202 LOW PROFILE .5"
|
- | Board Level | 0.520" (13.21mm) | Bolt On | TO-202 | 2.0W @ 50°C | 24.00°C/W | ||
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Wakefield-Vette |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK VERT/HORIZ BLACK TO-220
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262 | Board Level, Vertical | 0.570" (14.47mm) | Press Fit and PC Pin | TO-220 | 3.0W @ 80°C | 26.70°C/W | ||
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Wakefield-Vette |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK VERT/HORIZ BLACK TO-220
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262 | Board Level | 0.570" (14.47mm) | Press Fit and PC Pin | TO-220 | 3.0W @ 80°C | 26.70°C/W | ||
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Comair Rotron |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 12.7X13.2X19.1MM
|
- | Board Level, Vertical | 0.520" (13.21mm) | Bolt On and PC Pin | TO-220 | 1.5W @ 40°C | - | ||
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Comair Rotron |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK STAMP 12.7X13.2X19.1MM
|
- | Board Level | 0.520" (13.21mm) | Bolt On | TO-220 | 1.5W @ 40°C | - |
