- Material:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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Discover 4 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Length | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Length | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | ||
Advanced Thermal Solutions Inc. |
1,490
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 W/TAB BLACK
|
Aluminum | 1.380" (35.05mm) | Bolt On and PC Pin | - | 13.00°C/W @ 200 LFM | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Aluminum | 1.180" (29.97mm) | Clip and PC Pin | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | Black Anodized | ||||
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 COPPER W/TAB
|
Copper | 1.180" (29.97mm) | Bolt On and Board Mounts | - | 13.00°C/W @ 200 LFM | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Aluminum | 1.180" (29.97mm) | Clip and PC Pin | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | Tin |