Discover 6 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Shape Width Attachment Method Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
APF30-30-13CB/A01
CTS Thermal Management Products
3,956
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FORGED W/ADHESIVE TAPE
APF Top Mount Square, Fins 1.181" (30.00mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) - 2.50°C/W @ 200 LFM -
APF30-30-13CB
CTS Thermal Management Products
368
3 days
-
MOQ: 1  MPQ: 1
HEATSINK LOW-PROFILE FORGED
APF Top Mount Square, Fins 1.181" (30.00mm) Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) - 2.50°C/W @ 200 LFM -
ATS-PCB1036
Advanced Thermal Solutions Inc.
2,838
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/TAB BLACK
- Board Level, Vertical Rectangular, Angled Fins 1.000" (25.40mm) Bolt On and PC Pin TO-220 - 7.00°C/W @ 200 LFM 13.40°C/W
ATS-PCB1019
Advanced Thermal Solutions Inc.
2,773
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO-218/TO-202/TO-220
- Board Level Rectangular, Fins 1.000" (25.40mm) Bolt On TO-220, TO-202 - 10.10°C/W @ 200 LFM 22.00°C/W
V8502A
ASSMANN WSW Components
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 30X25.40MM
- Board Level, Vertical Rectangular, Fins 1.000" (25.40mm) Bolt On and PC Pin TO-220 3.0W @ 60°C 8.00°C/W @ 600 LFM 20.00°C/W
ATS-PCB1038
Advanced Thermal Solutions Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 W/TAB BLACK
- Board Level, Vertical Rectangular, Angled Fins 1.000" (25.40mm) Bolt On and PC Pin TO-220 - 7.00°C/W @ 200 LFM 13.40°C/W