- Type：
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- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CTS Thermal Management Products |
4,900
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Square, Fins | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 4.00°C/W @ 200 LFM | - | ||
|
|
Advanced Thermal Solutions Inc. |
1,484
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220 BLACK
|
- | Board Level | Rectangular, Fins | Bolt On | TO-220 | 8.90°C/W @ 200 LFM | 22.00°C/W | |||
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CTS Thermal Management Products |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Top Mount | Square, Fins | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 4.00°C/W @ 200 LFM | - |
