- Manufacturer：
-
- Series：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
Discover 5 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
|
|
ASSMANN WSW Components |
789
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | 1.378" (35.00mm) | 0.669" (17.00mm) | Bolt On | TO-220 | - | - | 17.00°C/W | ||
|
|
|
ASSMANN WSW Components |
214
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Board Level | 1.378" (35.00mm) | 0.669" (17.00mm) | Bolt On | TO-220 | - | - | 17.00°C/W | ||
|
|
Advanced Thermal Solutions Inc. |
74
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 62MM X 52MM X 13MM
|
maxiGRIP | Top Mount | 2.441" (62.00mm) | 2.047" (52.00mm) | Clip | Flip Chip Processors | - | 3.20°C/W @ 200 LFM | - | |||
|
|
Advanced Thermal Solutions Inc. |
65
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 62MM X 52MM X 13MM
|
maxiGRIP | Top Mount | 2.441" (62.00mm) | 2.047" (52.00mm) | Clip | Flip Chip Processors | - | 3.20°C/W @ 200 LFM | - | |||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | 1.774" (45.06mm) | 1.378" (35.00mm) | Bolt On and PC Pin | TO-220 | 3.0W @ 40°C | 4.00°C/W @ 400 LFM | 10.00°C/W |
