Discover 4 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Length Width Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
HS27
Apex Microtechnology
100
3 days
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MOQ: 1  MPQ: 1
HEATSINK 12P PWR SIP
Apex Precision Power Board Level 3.000" (76.20mm) 2.360" (59.94mm) PSIP - - 5.30°C/W
412310B02500
Comair Rotron
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK EXTRUDED 16X16.5X25.4MM
- Board Level, Vertical 1.000" (25.40mm) 0.650" (16.51mm) TO-220, TO-218 2.5W @ 50°C 3.00°C/W @ 700 LFM -
412320B02500
Comair Rotron
Inquiry
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-
MOQ: 1  MPQ: 1
HEATSINK EXTRUDED 16X16.5X50.8MM
- Board Level, Vertical 2.000" (50.80mm) 0.650" (16.51mm) TO-220, TO-218 1.5W @ 20°C 2.00°C/W @ 800 LFM -
412315B02500
Comair Rotron
Inquiry
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-
MOQ: 1  MPQ: 1
HEATSINK EXTRUDED 16X16.5X38.1MM
- Board Level, Vertical 1.500" (38.10mm) 0.650" (16.51mm) TO-220, TO-218 1.0W @ 20°C 5.00°C/W @ 200 LFM -