Discover 15 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Material Shape Length Width Attachment Method Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
WA-T220-101E
Ohmite
4,608
3 days
-
MOQ: 1  MPQ: 1
HEATSINK AND CLIP FOR TO-220 BLK
W Board Level, Vertical Aluminum Rectangular, Fins 1.201" (30.50mm) 0.720" (18.29mm) Clip and PC Pin TO-220 1.0W @ 20°C - 12.00°C/W
WA-T247-101E
Ohmite
8,370
3 days
-
MOQ: 1  MPQ: 1
HEATSINK AND CLIP FOR TO-247 BLK
W Board Level, Vertical Aluminum Rectangular, Fins 1.260" (32.00mm) 0.921" (23.40mm) Clip and PC Pin TO-247 1.0W @ 20°C 8.00°C/W @ 500 LFM 7.00°C/W
V7700W
ASSMANN WSW Components
3,658
3 days
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Board Level, Vertical Aluminum Rectangular, Fins 0.984" (25.00mm) 0.625" (16.00mm) Bolt On SOT-32, TO-220 - - 9.00°C/W
WA-T264-101E
Ohmite
820
3 days
-
MOQ: 1  MPQ: 1
HEATSINK W/CLIP FOR TO-264
W Board Level, Vertical Aluminum Rectangular, Fins 1.260" (32.00mm) 0.921" (23.40mm) Clip and PC Pin TO-264 1.0W @ 20°C 8.00°C/W @ 500 LFM 11.00°C/W
ATS-59008-C1-R0
Advanced Thermal Solutions Inc.
768
3 days
-
MOQ: 1  MPQ: 1
HEAT SINK 35MM X 46MM X 16MM
maxiGRIP Top Mount Aluminum Rectangular, Angled Fins 1.378" (35.00mm) 1.811" (46.00mm) Clip Flip Chip Processors - 2.40°C/W @ 200 LFM -
HS27
Apex Microtechnology
100
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 12P PWR SIP
Apex Precision Power Board Level Aluminum Rectangular, Fins 3.000" (76.20mm) 2.360" (59.94mm) Bolt On and PC Pin PSIP - - 5.30°C/W
WA-DT2-101E
Ohmite
92
3 days
-
MOQ: 1  MPQ: 1
HEATSINK DUAL FOR TO-220/247 BLK
W Board Level, Vertical Aluminum Rectangular, Fins 1.200" (30.48mm) 1.710" (43.43mm) Clip and PC Pin TO-220, TO-247 (Dual) 4.0W @ 40°C 6.00°C/W @ 200 LFM 5.00°C/W
ATS-56008-C4-R0
Advanced Thermal Solutions Inc.
76
3 days
-
MOQ: 1  MPQ: 1
HEAT SINK 50MM X 45MM X 16MM
maxiFLOW Top Mount Aluminum Rectangular, Angled Fins 1.969" (50.00mm) 1.772" (45.00mm) Thermal Tape, Adhesive (Not Included) ASIC - 2.10°C/W @ 200 LFM -
ATS-56008-C1-R0
Advanced Thermal Solutions Inc.
27
3 days
-
MOQ: 1  MPQ: 1
HEAT SINK 50MM X 45MM X 16.5MM
maxiFLOW Top Mount Aluminum Rectangular, Angled Fins 1.969" (50.00mm) 1.772" (45.00mm) Thermal Tape, Adhesive (Included) ASIC - 2.10°C/W @ 200 LFM -
HSE-B254-04H
CUI Inc.
934
3 days
-
MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION, TO-220/TO-
HSE Board Level, Vertical Aluminum Alloy Rectangular, Fins 1.000" (25.40mm) 0.650" (16.50mm) PC Pin TO-218, TO-220 4.7W @ 75°C 4.93°C/W @ 200 LFM 15.96°C/W
ATS-59007-C1-R0
Advanced Thermal Solutions Inc.
81
3 days
-
MOQ: 1  MPQ: 1
HEAT SINK 35MM X 46MM X 16MM
maxiGRIP Top Mount Aluminum Rectangular, Angled Fins 1.378" (35.00mm) 1.811" (46.00mm) Clip Flip Chip Processors - 2.40°C/W @ 200 LFM -
HSE-B381-04H
CUI Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION, TO-220/TO-
HSE Board Level, Vertical Aluminum Alloy Rectangular, Fins 1.500" (38.10mm) 0.650" (16.50mm) PC Pin TO-218, TO-220 5.9W @ 75°C 4.44°C/W @ 200 LFM 12.71°C/W
412310B02500
Comair Rotron
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK EXTRUDED 16X16.5X25.4MM
- Board Level, Vertical Aluminum Rectangular, Fins 1.000" (25.40mm) 0.650" (16.51mm) Bolt On and PC Pin TO-220, TO-218 2.5W @ 50°C 3.00°C/W @ 700 LFM -
412320B02500
Comair Rotron
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK EXTRUDED 16X16.5X50.8MM
- Board Level, Vertical Aluminum Rectangular, Fins 2.000" (50.80mm) 0.650" (16.51mm) Bolt On and PC Pin TO-220, TO-218 1.5W @ 20°C 2.00°C/W @ 800 LFM -
412315B02500
Comair Rotron
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK EXTRUDED 16X16.5X38.1MM
- Board Level, Vertical Aluminum Rectangular, Fins 1.500" (38.10mm) 0.650" (16.51mm) Bolt On and PC Pin TO-220, TO-218 1.0W @ 20°C 5.00°C/W @ 200 LFM -