Series:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Discover 2 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Material Width Attachment Method Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
HSE-B254-04H
CUI Inc.
934
3 days
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MOQ: 1  MPQ: 1
HEAT SINK, EXTRUSION, TO-220/TO-
HSE Aluminum Alloy 0.650" (16.50mm) PC Pin TO-218, TO-220 4.7W @ 75°C 4.93°C/W @ 200 LFM 15.96°C/W
412310B02500
Comair Rotron
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK EXTRUDED 16X16.5X25.4MM
- Aluminum 0.650" (16.51mm) Bolt On and PC Pin TO-220, TO-218 2.5W @ 50°C 3.00°C/W @ 700 LFM -