- Manufacturer:
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- Material:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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Discover 2 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
CUI Inc. |
934
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, EXTRUSION, TO-220/TO-
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HSE | Aluminum Alloy | 0.650" (16.50mm) | PC Pin | TO-218, TO-220 | 4.7W @ 75°C | 4.93°C/W @ 200 LFM | 15.96°C/W | ||||
Comair Rotron |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUDED 16X16.5X25.4MM
|
- | Aluminum | 0.650" (16.51mm) | Bolt On and PC Pin | TO-220, TO-218 | 2.5W @ 50°C | 3.00°C/W @ 700 LFM | - |