Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Discover 2 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Type Shape Length Width Attachment Method Package Cooled Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
575400B00000G
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Top Mount Rectangular, Fins 0.602" (15.29mm) - Press Fit TO-92 0.5W @ 20°C 20.00°C/W @ 200 LFM 40.00°C/W
553003B00000
Aavid, Thermal Division of Boyd Corporation
Inquiry
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-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level Square, Fins 1.780" (45.21mm) 1.780" (45.21mm) Bolt On TO-3 4.0W @ 30°C 2.00°C/W @ 400 LFM 6.60°C/W