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- Length:
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- Power Dissipation @ Temperature Rise:
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- Selected conditions:
Discover 4 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
CUI Inc. |
626
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 25
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HSE | Board Level, Vertical | Aluminum Alloy | 0.984" (25.00mm) | 1.378" (35.00mm) | PC Pin | 8.0W @ 75°C | 3.26°C/W @ 200 LFM | 9.38°C/W | ||||
CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 3.6W ALUMINUM
|
- | Top Mount | Aluminum | 0.279" (7.10mm) | 0.787" (20.00mm) | - | 3.6W @ 75°C | 7.45°C/W @ 200 LFM | 20.83°C/W | ||||
CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 50
|
HSE | Board Level, Vertical | Aluminum Alloy | 1.969" (50.00mm) | 1.378" (35.00mm) | PC Pin | 12.2W @ 75°C | 2.88°C/W @ 200 LFM | 6.15°C/W | ||||
CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, EXTRUSION, TO-220, 63
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HSE | Board Level, Vertical | Aluminum Alloy | 2.480" (63.00mm) | 1.378" (35.00mm) | PC Pin | 14.4W @ 75°C | 2.31°C/W @ 200 LFM | 5.21°C/W |