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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Selected conditions:
Discover 24 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Rectangular, Fins | 0.900" (22.86mm) | 1.020" (25.91mm) | Clip and PC Pin | 0.420" (10.67mm) | 6.00°C/W @ 500 LFM | 20.40°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rectangular, Fins | 0.690" (17.53mm) | 0.860" (21.84mm) | Clip and PC Pin | 0.395" (10.03mm) | 12.00°C/W @ 200 LFM | 21.60°C/W | ||||
Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 10X21.2X19MM
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Board Level | Rectangular | 0.750" (19.05mm) | 0.860" (21.84mm) | Bolt On | 0.355" (9.02mm) | 12.00°C/W @ 200 LFM | - | ||||
Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 10X21.2X19MM
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Board Level, Vertical | Rectangular | 0.750" (19.05mm) | 0.835" (21.21mm) | Bolt On and PC Pin | 0.394" (10.00mm) | 12.00°C/W @ 200 LFM | - |