Discover 4 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Type Length Width Attachment Method Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
7173DG
Aavid, Thermal Division of Boyd Corporation
15,536
3 days
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MOQ: 1  MPQ: 1
BOARD LEVEL HEATSINK .375"TO-220
Board Level, Vertical 0.750" (19.05mm) 0.750" (19.05mm) Bolt On and PC Pin 0.375" (9.52mm) 10.00°C/W @ 200 LFM 25.80°C/W
7139DG
Aavid, Thermal Division of Boyd Corporation
9,535
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-220 TIN CLIP-ON 13MM
Board Level 0.780" (19.81mm) 0.520" (13.21mm) Clip and PC Pin 0.515" (13.08mm) 8.00°C/W @ 500 LFM 28.30°C/W
7137DG
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level, Vertical 0.848" (21.55mm) 0.900" (22.86mm) Clip and PC Pin 0.375" (9.52mm) 10.00°C/W @ 200 LFM 20.80°C/W
7140DG
Aavid, Thermal Division of Boyd Corporation
Inquiry
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-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level 0.700" (17.78mm) 0.900" (22.86mm) Clip and PC Pin 0.375" (9.52mm) 10.00°C/W @ 200 LFM 20.80°C/W