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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Selected conditions:
Discover 8 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
8,455
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 W/TAB .25
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Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On and PC Pin | 0.250" (6.35mm) | 16.00°C/W @ 200 LFM | 32.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
15,536
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3 days |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375"TO-220
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Board Level, Vertical | Copper | 0.750" (19.05mm) | 0.750" (19.05mm) | Bolt On and PC Pin | 0.375" (9.52mm) | 10.00°C/W @ 200 LFM | 25.80°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
9,535
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TIN CLIP-ON 13MM
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Board Level | Copper | 0.780" (19.81mm) | 0.520" (13.21mm) | Clip and PC Pin | 0.515" (13.08mm) | 8.00°C/W @ 500 LFM | 28.30°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
452
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK TO-220 .250" COMPACT
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Board Level | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | 0.250" (6.35mm) | 10.00°C/W @ 500 LFM | 32.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Copper | 0.848" (21.55mm) | 0.900" (22.86mm) | Clip and PC Pin | 0.375" (9.52mm) | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Copper | 0.700" (17.78mm) | 0.900" (22.86mm) | Clip and PC Pin | 0.375" (9.52mm) | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 6.4X13.2X19.1MM
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Board Level | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On | 0.250" (6.35mm) | 10.00°C/W @ 500 LFM | - | Black Anodized | ||
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Comair Rotron |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 6.4X13.3X19.1MM
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Board Level, Vertical | Aluminum | 0.750" (19.05mm) | 0.520" (13.21mm) | Bolt On and PC Pin | 0.250" (6.35mm) | 16.00°C/W @ 200 LFM | - | Black Anodized |
