Discover 8 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Type Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural
591202B00000G
Aavid, Thermal Division of Boyd Corporation
15,923
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-220 VERT/HORZ MOUNT
Board Level Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - Clip TO-220, TO-262 0.500" (12.70mm) 16.00°C/W @ 200 LFM 26.80°C/W
508500B00000G
Aavid, Thermal Division of Boyd Corporation
24,857
3 days
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MOQ: 1  MPQ: 1
HEATSINK 24-PIN DIP GLUE-ON BLK
Top Mount Rectangular, Fins 1.250" (31.75mm) 0.530" (13.46mm) - Thermal Tape, Adhesive (Not Included) 24-DIP 0.190" (4.83mm) 15.00°C/W @ 500 LFM 34.00°C/W
591202B04000G
Aavid, Thermal Division of Boyd Corporation
9,752
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-220 CLIP-ON/TAB
Board Level, Vertical Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - Clip and PC Pin TO-220, TO-262 0.500" (12.70mm) 16.00°C/W @ 200 LFM 26.80°C/W
591202B03700G
Aavid, Thermal Division of Boyd Corporation
3,574
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-220 CLIP-ON BLACK
Board Level, Vertical Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - Clip and PC Pin TO-220 0.500" (12.70mm) 16.00°C/W @ 200 LFM 26.80°C/W
591202B03100G
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - Clip and PC Pin TO-220, TO-262 0.500" (12.70mm) 16.00°C/W @ 200 LFM 26.80°C/W
578105B00000G
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Top Mount Rectangular, Fins 0.406" (10.31mm) 0.830" (21.08mm) 0.316" (8.03mm) ID Press Fit TO-5 0.395" (10.03mm) 35.00°C/W @ 200 LFM 40.00°C/W
2286B
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level Square 0.790" (20.07mm) 0.790" (20.07mm) - Thermal Tape, Adhesive (Not Included) BGA 0.155" (3.94mm) 20.00°C/W @ 200 LFM -
2283B
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
Board Level Square, Fins 0.655" (16.64mm) 0.655" (16.64mm) - Thermal Tape, Adhesive (Not Included) BGA 0.265" (6.73mm) 17.50°C/W @ 300 LFM -