- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CUI Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 3.6W ALUMINUM
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Top Mount | 0.279" (7.10mm) | 0.787" (20.00mm) | - | 1.000" (25.40mm) | 7.45°C/W @ 200 LFM | 20.83°C/W | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 3.6W ALUMINUM
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Board Level | 0.748" (19.00mm) | 0.830" (21.08mm) | - | 0.394" (10.00mm) | 5.39°C/W @ 200 LFM | 20.59°C/W | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 3.6W ALUMINUM
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Board Level, Vertical | 0.394" (10.00mm) | 0.830" (21.08mm) | PC Pin | 0.748" (19.00mm) | 5.39°C/W @ 200 LFM | 20.59°C/W | ||
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|
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CUI Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 3.6W ALUMINUM
|
Board Level, Vertical | 0.394" (10.00mm) | 0.830" (21.08mm) | PC Pin | 0.748" (19.00mm) | 5.39°C/W @ 200 LFM | 20.59°C/W |
