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Discover 47 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Material Finish | |
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t-Global Technology |
5,067
|
3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 10X10X2MM
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XL-25 | Heat Spreader | Ceramic | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | ||
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t-Global Technology |
2,715
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | ||
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t-Global Technology |
5,198
|
3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 20X20X2MM
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XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | ||
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t-Global Technology |
4,024
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | ||
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t-Global Technology |
4,065
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 12X12X10MM W/TAPE
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- | Heat Spreader | Ceramic | Square, Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | Thermal Tape, Adhesive (Included) | - | 0.394" (10.00mm) | - | ||
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t-Global Technology |
1,483
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 20X20X6MM W/TAPE
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- | Heat Spreader | Ceramic | Square, Fins | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | ||
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t-Global Technology |
367
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CER 30.5X30.5X6MM W/TAP
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- | Heat Spreader | Ceramic | Square, Fins | 1.201" (30.50mm) | 1.201" (30.50mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | ||
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t-Global Technology |
166
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3 101.6X38.1X0.21MM
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PH3 | Heat Spreader | Copper | Rectangular | 4.000" (101.60mm) | 1.500" (38.10mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | Polyester | ||
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t-Global Technology |
1,228
|
3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 30X30MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | ||
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t-Global Technology |
4,410
|
3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 40X40X3MM
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XL-25 | Heat Spreader | Ceramic | Square | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.118" (3.00mm) | - | ||
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t-Global Technology |
1,145
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 12X12X10MM
|
- | Heat Spreader | Ceramic | Square, Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | - | - | 0.394" (10.00mm) | - | ||
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t-Global Technology |
101
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 43X43X6MM
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- | Heat Spreader | Ceramic | Square, Fins | 1.693" (43.00mm) | 1.693" (43.00mm) | - | - | 0.236" (6.00mm) | - | ||
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t-Global Technology |
385
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 50.8X12.07X0.062MM
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PH3n | Heat Spreader | Copper | Rectangular | 2.000" (50.80mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | Polyester | ||
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|
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t-Global Technology |
946
|
3 days |
-
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MOQ: 1 MPQ: 1
|
XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | Square | 0.393" (10.00mm) | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | ||
|
|
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t-Global Technology |
813
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CER 20X20X6MM
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- | Heat Spreader | Ceramic | Square, Fins | 0.787" (20.00mm) | 0.787" (20.00mm) | - | - | 0.236" (6.00mm) | - | ||
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t-Global Technology |
264
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER 32X32X6MM W/TAPE
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- | Heat Spreader | Ceramic | Square, Fins | 1.260" (32.00mm) | 1.260" (32.00mm) | Thermal Tape, Adhesive (Included) | - | 0.236" (6.00mm) | - | ||
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|
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t-Global Technology |
53
|
3 days |
-
|
MOQ: 1 MPQ: 1
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HEATSINK CER 60X60X15MM W/TAPE
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- | Heat Spreader | Ceramic | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | Thermal Tape, Adhesive (Included) | - | 0.590" (15.00mm) | - | ||
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t-Global Technology |
238
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 50.8X12.07X0.07MM
|
PH3n | Heat Spreader | Copper | Rectangular | 2.000" (50.80mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | Polyester | ||
|
|
|
t-Global Technology |
116
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3 50.8X12.07X0.21MM
|
PH3 | Heat Spreader | Copper | Rectangular | 2.000" (50.80mm) | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | Polyester | ||
|
|
|
t-Global Technology |
120
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X25.4X0.062MM
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PH3n | Heat Spreader | Copper | Rectangular | 3.000" (76.20mm) | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | Polyester |
