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Discover 15 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
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t-Global Technology |
5,067
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 10X10X2MM
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XL-25 | Heat Spreader | Ceramic | 0.393" (10.00mm) | 0.393" (10.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
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t-Global Technology |
2,715
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | 0.393" (10.00mm) | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | ||
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t-Global Technology |
5,198
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 20X20X2MM
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XL-25 | Heat Spreader | Ceramic | 0.787" (20.00mm) | 0.787" (20.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
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t-Global Technology |
4,024
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.089" (2.25mm) | - | - | ||
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t-Global Technology |
1,228
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 30X30MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | 1.181" (30.00mm) | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | ||
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t-Global Technology |
4,410
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 40X40X3MM
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XL-25 | Heat Spreader | Ceramic | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.118" (3.00mm) | - | - | ||
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t-Global Technology |
946
|
3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 10X10MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | 0.393" (10.00mm) | 0.393" (10.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | ||
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t-Global Technology |
491
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 30X30X2MM
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XL-25 | Heat Spreader | Ceramic | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
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t-Global Technology |
391
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3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC 20X20MM W/LI98C ADH
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XL-25 | Heat Spreader | Ceramic | 0.787" (20.00mm) | 0.787" (20.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | ||
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t-Global Technology |
266
|
3 days |
-
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MOQ: 1 MPQ: 1
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XL25 CERAMIC BOARD 40X40X2MM
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XL-25 | Heat Spreader | Ceramic | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
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t-Global Technology |
30
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3 days |
-
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MOQ: 1 MPQ: 1
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IR HEAT SPREADER/EMITTER W/ADH
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PH3 | Heat Spreader | Copper | 3.937" (100.00mm) | 3.937" (100.00mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | Polyester | ||
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t-Global Technology |
38
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3 days |
-
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MOQ: 1 MPQ: 1
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IR HEAT SPREADER/EMITTER W/ADH
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PH3 | Heat Spreader | Copper | 5.906" (150.00mm) | 5.910" (150.00mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | Polyester | ||
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t-Global Technology |
6
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3 days |
-
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MOQ: 1 MPQ: 1
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IR HEAT SPREADER/EMITTER W/ADH
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PH3 | Heat Spreader | Copper | 11.800" (299.72mm) | 11.811" (300.00mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | Polyester | ||
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t-Global Technology |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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PH3N 100X100X0.07MM W/ADH
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PH3n | Heat Spreader | Copper | 3.937" (100.00mm) | 3.937" (100.00mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | Polyester | ||
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Delta Electronics |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK ASSY INTEL LGA1366
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- | Board Level | Aluminum | 3.543" (90.00mm) | 3.543" (90.00mm) | Bolt On | LGA | 1.004" (25.50mm) | 0.27°C/W | - |
