- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Material Finish：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Material Finish | |
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Ohmite |
124
|
3 days |
-
|
MOQ: 1 MPQ: 1
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HEATSINK W/CLIP FOR TO-264
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R2 | Board Level | 1.500" (38.10mm) | 1.380" (35.05mm) | Clip and PC Pin | TO-264 | 0.870" (22.10mm) | - | Unfinished | ||
|
|
|
Ohmite |
50
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-220
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R2 | Board Level | 1.500" (38.10mm) | 1.380" (35.05mm) | Clip and PC Pin | TO-220 | 0.870" (22.10mm) | - | Degreased | ||
|
|
|
Ohmite |
82
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK BLACK ANODIZED
|
CSM | Board Level, Vertical | 1.969" (50.00mm) | 0.411" (10.45mm) | Solderable Feet | TO-220 | 1.228" (31.20mm) | 3.0W @ 30°C | Black Anodized |
