Discover 6 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Material Shape Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Natural Material Finish
XLI98C-30-2.15-P
t-Global Technology
1,228
3 days
-
MOQ: 1  MPQ: 1
XL25 CERAMIC 30X30MM W/LI98C ADH
XL-25 Heat Spreader Ceramic Square 1.181" (30.00mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.085" (2.15mm) - -
V5220L
ASSMANN WSW Components
154
3 days
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD TO-220
- Board Level Aluminum Rectangular, Fins 1.260" (32.00mm) Bolt On TO-220 0.787" (19.99mm) 8.00°C/W Black Anodized
XL25-30-30-2
t-Global Technology
491
3 days
-
MOQ: 1  MPQ: 1
XL25 CERAMIC BOARD 30X30X2MM
XL-25 Heat Spreader Ceramic Square 1.181" (30.00mm) - Assorted (BGA, LGA, CPU, ASIC...) 0.079" (2.00mm) - -
V5229L
ASSMANN WSW Components
295
3 days
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Top Mount Aluminum Rectangular, Fins 1.260" (32.00mm) Bolt On TO-220 0.551" (14.00mm) - Black Anodized
C264-030-1VE
Ohmite
46
3 days
-
MOQ: 1  MPQ: 1
HEATSINK AND CLIP FOR TO-264
C Board Level, Vertical Aluminum Rectangular, Fins 1.500" (38.10mm) Clip and PC Pin TO-264 0.710" (18.03mm) - Degreased
C264-030-1AE
Ohmite
52
3 days
-
MOQ: 1  MPQ: 1
HEATSINK AND CLIP FOR TO-264
C Board Level, Vertical Aluminum Rectangular, Fins 1.500" (38.10mm) Clip and PC Pin TO-264 0.710" (18.03mm) - Black Anodized