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Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | Material Finish | |
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t-Global Technology |
1,228
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC 30X30MM W/LI98C ADH
|
XL-25 | Heat Spreader | Ceramic | Square | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.085" (2.15mm) | - | - | ||
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ASSMANN WSW Components |
154
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD TO-220
|
- | Board Level | Aluminum | Rectangular, Fins | 1.260" (32.00mm) | Bolt On | TO-220 | 0.787" (19.99mm) | 8.00°C/W | Black Anodized | ||
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t-Global Technology |
491
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
XL25 CERAMIC BOARD 30X30X2MM
|
XL-25 | Heat Spreader | Ceramic | Square | 1.181" (30.00mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.079" (2.00mm) | - | - | ||
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ASSMANN WSW Components |
295
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Top Mount | Aluminum | Rectangular, Fins | 1.260" (32.00mm) | Bolt On | TO-220 | 0.551" (14.00mm) | - | Black Anodized | ||
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Ohmite |
46
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIP FOR TO-264
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | Clip and PC Pin | TO-264 | 0.710" (18.03mm) | - | Degreased | ||
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Ohmite |
52
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AND CLIP FOR TO-264
|
C | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | Clip and PC Pin | TO-264 | 0.710" (18.03mm) | - | Black Anodized |