Discover 5 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Material Shape Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Natural Material Finish
XL25-40-40-3
t-Global Technology
4,410
3 days
-
MOQ: 1  MPQ: 1
XL25 CERAMIC BOARD 40X40X3MM
XL-25 Heat Spreader Ceramic Square 1.575" (40.01mm) - Assorted (BGA, LGA, CPU, ASIC...) 0.118" (3.00mm) - -
XL25-40-40-2
t-Global Technology
266
3 days
-
MOQ: 1  MPQ: 1
XL25 CERAMIC BOARD 40X40X2MM
XL-25 Heat Spreader Ceramic Square 1.575" (40.01mm) - Assorted (BGA, LGA, CPU, ASIC...) 0.079" (2.00mm) - -
V8818Q
ASSMANN WSW Components
106
3 days
-
MOQ: 1  MPQ: 1
HEATSINK ALUM ANOD
- Board Level Aluminum Rectangular, Fins 0.748" (19.00mm) Bolt On and PC Pin SOT-32, TO-220 0.844" (21.44mm) 8.80°C/W Black Anodized
C126-040-2VE
Ohmite
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK FOR TO-126 40MM
C Board Level, Vertical Aluminum Rectangular, Fins 1.280" (32.51mm) 2 Clips and PC Pin TO-126 0.732" (18.60mm) - Degreased
C126-040-2AE
Ohmite
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK FOR TO-126 40MM
C Board Level, Vertical Aluminum Rectangular, Fins 1.280" (32.51mm) 2 Clips and PC Pin TO-126 0.732" (18.60mm) - Black Anodized