- Type:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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Discover 4 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | ||
Wakefield-Vette |
2,632
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 40.6MM SQ H=.525"
|
655 | Top Mount | 1.600" (40.64mm) | 1.600" (40.64mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 4.0W @ 40°C | - | ||||
Aavid, Thermal Division of Boyd Corporation |
2,329
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 12W H=1.25" BLK
|
- | Board Level | 1.810" (45.97mm) | 1.810" (45.97mm) | Bolt On | TO-3 | 1.250" (31.75mm) | 10.0W @ 50°C | 5.00°C/W | ||||
Wakefield-Vette |
4,378
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | - | ||||
Wakefield-Vette |
Inquiry
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- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
628 | Top Mount | 1.750" (44.45mm) | 1.700" (43.18mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.650" (16.51mm) | 3.0W @ 20°C | - |