Discover 4 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural
655-53AB
Wakefield-Vette
2,632
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU 40.6MM SQ H=.525"
655 Top Mount 1.600" (40.64mm) 1.600" (40.64mm) Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) 0.522" (13.27mm) 4.0W @ 40°C -
500403B00000G
Aavid, Thermal Division of Boyd Corporation
2,329
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO-3 12W H=1.25" BLK
- Board Level 1.810" (45.97mm) 1.810" (45.97mm) Bolt On TO-3 1.250" (31.75mm) 10.0W @ 50°C 5.00°C/W
628-65AB
Wakefield-Vette
4,378
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU 43MM SQ BLK H=.65"
628 Top Mount 1.750" (44.45mm) 1.700" (43.18mm) Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) 0.650" (16.51mm) 3.0W @ 20°C -
628-65ABT5
Wakefield-Vette
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK CPU 43MM SQ BLK H=.65"
628 Top Mount 1.750" (44.45mm) 1.700" (43.18mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.650" (16.51mm) 3.0W @ 20°C -