- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
1,820
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 SOLDERPIN 38.1MM
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Board Level, Vertical | Bolt On and PC Pin | 6.0W @ 40°C | 5.50°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 PIN BLACK
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Board Level, Vertical | Bolt On and PC Pin | 4.0W @ 30°C | 4.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Bolt On | 6.0W @ 40°C | 5.50°C/W |
