Discover 7 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Natural Material Finish
APF19-19-10CB/A01
CTS Thermal Management Products
1,900
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FORGED W/ADHESIVE TAPE
APF 0.748" (19.00mm) 0.748" (19.00mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.370" (9.40mm) - Black Anodized
APF19-19-10CB
CTS Thermal Management Products
371
3 days
-
MOQ: 1  MPQ: 1
HEATSINK LOW-PROFILE FORGED
APF 0.748" (19.00mm) 0.748" (19.00mm) Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) 0.370" (9.40mm) - Black Anodized
ATS-X53270P-C1-R0
Advanced Thermal Solutions Inc.
256
3 days
-
MOQ: 1  MPQ: 1
SUPERGRIP HEATSINK 27X27X17.5MM
superGRIP 1.063" (27.00mm) 1.063" (27.00mm) Clip, Thermal Material BGA 0.689" (17.50mm) - Blue Anodized
ATS-54270R-C1-R0
Advanced Thermal Solutions Inc.
89
3 days
-
MOQ: 1  MPQ: 1
HEAT SINK 27MM X 27MM X 19.5MM
- 1.063" (27.00mm) 1.063" (27.00mm) Thermal Tape, Adhesive (Included) BGA 0.768" (19.50mm) - Black Anodized
ATS-53270R-C1-R0
Advanced Thermal Solutions Inc.
58
3 days
-
MOQ: 1  MPQ: 1
HEAT SINK 27MM X 27MM X 19.5MM
maxiGRIP 1.063" (27.00mm) 1.063" (27.00mm) Clip, Thermal Material BGA 0.768" (19.50mm) - Black Anodized
335214B00032G
Aavid, Thermal Division of Boyd Corporation
Inquiry
-
-
MOQ: 1  MPQ: 1
BGA HEAT SINK
- 0.985" (25.02mm) 0.985" (25.02mm) Thermal Tape, Adhesive (Included) BGA 0.390" (9.91mm) 10.00°C/W Black Anodized
ATS-54270R-C0-R0
Advanced Thermal Solutions Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK 27X27X19.5MM W/OUT TIM
- 1.063" (27.00mm) 1.063" (27.00mm) Thermal Tape, Adhesive (Not Included) BGA 0.768" (19.50mm) - Black Anodized