- Series：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | |
|
Advanced Thermal Solutions Inc. |
4,769
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9MM
|
maxiFLOW | Square, Angled Fins | Thermal Tape, Adhesive (Included) | ASIC | 0.354" (9.00mm) | |||
|
|
|
CTS Thermal Management Products |
1,900
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Square, Fins | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | ||
|
|
|
CTS Thermal Management Products |
371
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | ||
|
|
Advanced Thermal Solutions Inc. |
475
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9MM
|
maxiFLOW | Square, Angled Fins | Thermal Tape, Adhesive (Not Included) | ASIC | 0.354" (9.00mm) |
